company news about Successful delivery: HDI Buried Hole Reliability Tester！

Successful delivery: HDI Buried Hole Reliability Tester. Thanks to Mr. Chen's trust, we have been sticking to quality for more than ten years, just to get the recognition of old customers.

HDI process PCB board HCT withstand current test is a test method to test the reliability of the hole interconnection of printed circuit board products, and at present, manufacturers (OPPO, VIVO, Amaz) and other manufacturers need printed board suppliers to introduce HCT test. The current resistance test is to apply a certain DC current on the specially designed hole chain, and for a period of time, the current produces Joule heating on the hole chain, and the heat is transferred to the substrate near the hole chain, and the substrate is heated and expanded to produce Z-direction expansion stress resulting in blind hole breakage, so as to detect the interconnection reliability performance of the hole chain